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Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Yamato: Raising the target price of IWC to HK$ 20 has a more positive view on next year's revenue growth. Yamato published a report that under the strong demand from Malaysia, the bank has a more positive view on IWC's revenue growth next year. In addition, the bank believes that the external financing of operating GDSI, a data center outside the mainland, will release shareholder value. However, as GDSI will be separated from IWC's consolidated statements in the fourth quarter of this year, the bank believes that IWC's short-term re-evaluation will still mainly depend on its mainland business performance, so it still maintains a wait-and-see attitude. The bank maintained its "hold" rating on IWC, and its target price was raised from HK$ 8.6 to HK$ 20. Considering the increase in capital expenditure of IWC from 2025 to 2026, the bank raised its revenue forecast for this year and next by 5% to 24%, mainly due to the strong demand in the international market driven by short video platforms. In addition, in view of the fact that the company raised its capital expenditure guideline from 6.5 billion yuan to 11 billion yuan this year, the bank raised its capital expenditure forecast from 6.7 billion yuan to 11 billion yuan in 2024 and from 3.5 billion yuan to 10.5 billion yuan in 2025. In addition, the bank will raise the adjusted EBITDA forecast of IWC this year and next by 4% to 13% to consider the EBITDA contribution of its overseas business; It is estimated that the total revenue will increase by 15% this year (10% compared with the previous forecast) and 33% next year (15% compared with the previous forecast). The adjusted EBITDA is expected to increase by 11% and 25% this year and next (8% and 15% compared with the previous forecast).India's NIFTY 50 index fell, with the latest drop of 0.1%.

The main contract of CSI 500 stock index futures (IC) expanded to 1.00% in the day and is now reported at 6104.4 points. The main contract of CSI 500 stock index futures (IC) stood at 6100 points, rising by 0.99% in the day.Market news: Britain is considering the largest auction of renewable energy subsidies in history.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)

Pakistan KSE-100 Index rose 2% to 113,268.80.CSRC: Optimize the supply of products in time and include the first batch of index funds in the catalogue of personal pension investment products. Recently, the Ministry of Human Resources and Social Security, the Ministry of Finance, the State Administration of Taxation, the General Administration of Financial Supervision and the CSRC jointly issued the Notice on the Full Implementation of the Personal Pension System (hereinafter referred to as the Notice), and the personal pension system will be extended to the whole country on December 15. Personal pension is long-term, persistent and large-scale. By actively investing in the capital market, it is conducive to sharing the fruits of the development of the real economy and helping to maintain and increase value for a long time. As a representative of professional institutional investors in the capital market, Public Offering of Fund industry has been entrusted to manage all kinds of pension assets over 6 trillion yuan, creating good long-term income and accumulating rich management experience. According to the requirements of the Notice, the CSRC timely optimized the product supply and included the first batch of index funds in the catalogue of personal pension investment products. Subsequently, the CSRC will strengthen the supervision of personal pension investment in Public Offering of Fund, urge Public Offering of Fund managers to continuously improve their management and service capabilities, and better support the high-quality development of personal pensions. (CSRC)Employees demand to pay social security. Xia Yiping: The problems are all being solved. If you escape, you won't come. Some netizens posted a video showing that Xia Yiping, CEO of Ji Yue, was surrounded by employees in the company, and some employees shouted at Xia Yiping: "Take out your savings and pay social security to employees." Some employees at the scene said that if social security is broken, how many people will be affected, don't talk empty talk. Xia Yiping responded that knowing that everyone is very angry, everyone has followed us for so long, and I am very grateful. "These problems are being solved. Now I am communicating with you. If I escape, I will not come." Xia Yiping, CEO of Extreme Vietnam, issued an internal letter on the afternoon of the 11th, acknowledging that the company was encountering difficulties and needed immediate adjustment. (Sina Technology)